THERMOELECTRIC MODULES WITH COMPENSATED CONNECTION PLATES FOR SHIP POWER DEVICES

Abstract

The article analyzes thermoelectric modules with compensated connection plates for ship power devices. The study is related to topical issues of elimination or reduction to acceptable limits of thermal stresses in thermoelectric modules. Thermal stresses arise in them due to the existing thermal expansions and contractions of electrical materials, which are the result of simultaneous heating and cooling in semiconductors. On the basis of five created models of thermoelectric elements, by connecting them into the П-shaped snake», five models of the corresponding thermoelectric modules were formed. One module had the classic design, and four others had compensated contact connection plates. Each of these thermoelectric modules consisted of 39 semiconductor thermocouples, containing 20 P-type semiconductors and 20 N-type semiconductors. Upper (hot) contact connection plates in the amount of 20 pcs. were compensated connected plates in the form of spring plates, the thermoelectric module with the classic design did not contain compensating elements (compensators). The overall dimensions of the five thermoelectric modules to be analyzed were as follows: one classic design and three designs with compensators 50×59×6 mm, one design with an increased thickness of the compensator 52×62×7 mm. Based on the results of the calculation, the distribution of the main operating parameters over the volume of thermoelectric elements was obtained. The performance characteristics of thermoelectric modules are constructed and analyzed with a change in the operating current from 0 to 5 A for current density, voltage, electric field strength, temperature difference between hot and cold contact switching plates, heat flux density, resistive stress heating and strain magnitude. The advantages of using numerical calculation methods for solving field problems of the ship power industry are shown.